ODT - THESIS TOPIC: Richárd Berényi: Metal bonding and energy ...


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Thesis topic proposal

Metal bonding and energy diffusion simulation in the semiconductor packaging systems

THESIS TOPIC PROPOSAL

Institute: Budapest University of Technology and Economics
electrical engineering
Doctoral School of Electrical Engineering

Thesis supervisor: Richárd Berényi
Location of studies (in Hungarian): Elektronikai Technológia Tanszék
Abbreviation of location of studies: ETT

Description of the research topic:

"For metal bonding, higher energy than bonding energy is needed to be supplied to the bonding place.
And supplied energy is diffuse at the bonding place.
But energy is not enough for bonding energy then metal bonding is failed.

To find the condition for bonding, it have to do the energy diffusion simulation.
If simulate the energy diffusion at the bonding place, then calculate the energy distribution.
The high energy part of the energy distribution is enough to bonding energy then bonding occurs at that part.
"

Required language skills: English
Number of students who can be accepted: 1

Deadline for application: 2021-09-01

2024. IV. 17.
ODT ülés
Az ODT következő ülésére 2024. június 14-én, pénteken 10.00 órakor kerül sor a Semmelweis Egyetem Szenátusi termében (Bp. Üllői út 26. I. emelet).