Thesis supervisor: Attila Géczy
Location of studies (in Hungarian): Department of Electronics Technology Abbreviation of location of studies: ETT
Description of the research topic:
High-density packaging is a current trend in electronics manufacturing, where smaller components, higher lead counts, and sophisticated assembling methods are gaining ground to achieve the required quality and reliability norms of the manufactured electronic devices. The research aims to focus on these trends supplementing the current and future requirements of the industry. From the aspect of components, the introduction of smaller scale surface mount devices implies new aspects from the assembling side. The standard steps of surface mounting and reflow soldering (solder printing, component placement, heat transfer) need constant improvements in order to follow the quality expectations. The most critical part is the heating, where the thermal relations may not only affect the metallurgic aspects of the joints, but the process may cause structural problems in the components and the printed circuit board substrates as well. Also the design standards may need re-evaluation in order to comply with the smaller packaging dimensions. During the work, the PhD student must investigate the surface mounting assembly process from different aspects, focusing on the substrates and the components. Application of novel approaches in standard assembling technologies must be investigated, with the possible application of new materials as well (such as bio-based, bio-degradables and other green substrates) The student must be able to prepare novel measurement methodologies, and may implement and perform modelling with the focus on board-level and component-level assembling, to progress towards more efficient production and balanced quality norms. Previous experience in such fields are welcome, but not required. The student would join the research at the department, where the field is included in the active research topics.
Required language skills: english Further requirements: Matlab, Comsol, alapvető grafikai szerkesztő ismeretek
Number of students who can be accepted: 1
Deadline for application: 2021-01-05
2024. IV. 17. ODT ülés Az ODT következő ülésére 2024. június 14-én, pénteken 10.00 órakor kerül sor a Semmelweis Egyetem Szenátusi termében (Bp. Üllői út 26. I. emelet).
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