Thesis supervisor: Balázs Illés
Location of studies (in Hungarian): Department of Electronics Technology Abbreviation of location of studies: ETT
Description of the research topic:
Due to the directives of the European Union (Restriction of Hazardous Substances: RoHS directive), the application of lead as an alloying element was banned in the solder alloys. The new lead-free solder alloys need much more accurate temperature control and management than the leaded ones. There is a need in the electronics industry for development of new soldering technologies and further development of the widely used convection reflow soldering technology. The main disadvantages of the convection reflow soldering are the low efficiency (which causes environmental protection issues), the shadowing effect of the large components on the gas streams and the forming of turbulent areas in the gas flow velocity space. Therefore, the latest researches focuses on the development of insufflation and extraction systems, as well as on the optimization of the inner construction of the process zones in order to increase efficiency and avoid the previously mentioned defects. Some years ago, beside the convection reflow technology, the so-called Vapour Phase Soldering (VPS) has started to spread. The heat transfer method of the VPS is technology is totally differs from the convection or infrared technologies. During the process, a special heat transfer fluid is boiled and a vapour blanket is generated, the assembled PCB is immersed into the vapour, consequently a condensate layer forms on the colder surface of the PCB. This layer transfers the latent heat of condensing mass and the conducted heat from surrounding vapour to the assembly. However many physical aspects of this technology are unclear or unreached (e.g. the forming of the vapour space, the effect of the assembly on the vapour space characteristics, the build-up of the condensate layer, the exact heat and mass transport process in the condensate). The previous issues are a good base for new researches in this field. The previously discussed soldering technologies are carried out in closed areas, and they are hardly examinable by measurement methods due to high temperature. Consequently the numerical simulations have high importance in this field of science.
Actual research fields of the topic at the Department of Electronics Technology:
• Investigating soldering technologies and ovens by numerical simulations and in-situ measurement methods. Physical modelling of soldering ovens, development of new ovens and control procedures.
• Quality and reliability tests of solder joints by analytical measurements and environmental/life-time tests.
Required language skills: English Further requirements: basic knowledge in numerical modelling and material sciences
Number of students who can be accepted: 1
Deadline for application: 2018-07-30
2024. IV. 17. ODT ülés Az ODT következő ülésére 2024. június 14-én, pénteken 10.00 órakor kerül sor a Semmelweis Egyetem Szenátusi termében (Bp. Üllői út 26. I. emelet).
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