Print previewpersonal data approved: 2023. I. 29. Publications |
2020
 from data base, 2021. I. 27. |
Farkas Gabor, Schweitzer Dirk, Sarkany Zoltan, Rencz Marta: On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices, ENERGIES 13: (3) p. 557. type of document: Journal paper/Article language: English URL |
2019
 from data base, 2021. I. 27. |
Poppe András, Farkas Gábor, Gaál Lajos, Hantos Gusztáv, Hegedüs János, Rencz Márta: Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires, ENERGIES 12: (10) p. 1909. type of document: Journal paper/Article number of independent citations: 11 language: English URL |
2019
 from data base, 2021. I. 27. |
Pálovics Péter, Rencz Márta: Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices, In: W.D., Van Driel; P., Rodgers; C., Bailey; B., Vandevelde; O., de Saint Leger; G.Q., Zhang (szerk.) Proceedings of EuroSimE 2019, (2019) pp. 181-187. type of document: Conference paper/Előadás vagy poszter cikke language: English URL |
2019
 from data base, 2021. I. 27. |
Márta Rencz, András Poppe, Gábor Farkas: Determination of the Complex Thermal Characteristics of Discrete Power Devices and Power Modules, In: Proceedings of the 21st Electronics Packaging Technology Conference (EPTC'19), IEEE (2019) Paper 231 type of document: Conference paper/Előadás vagy poszter cikke language: English URL |
2018
 from data base, 2021. I. 27. |
Farkas Gábor, Hara Tomoaki, Rencz Márta: Thermal transient testing, In: Katsuaki, Suganuma (szerk.) Wide Bandgap Power Semiconductor Packaging, Woodhead Publishing (2018) pp. 127-153. type of document: Part of book/Könyvfejezet (to be translated) language: English URL |
2002
 from data base, 2021. I. 27. |
M. Rencz, V. Székely: Measuring partial thermal resistances in a heat-flow path, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 25: (4) pp. 547-553. type of document: Journal paper/Article number of independent citations: 90 language: English URL |
2001
 from data base, 2021. I. 27. |
Rencz M, Szekely V: Dynamic Thermal Multiport Modeling of IC Packages, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 24: (4) pp. 596-604. type of document: Journal paper/Article number of independent citations: 63 language: English URL |
2000
 from data base, 2021. I. 27. |
Szekely V, Rencz M: Thermal Dynamics and the Time Constant Domain, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 23: (3) pp. 587-594. type of document: Journal paper/Article number of independent citations: 69 language: English URL |
1997
 from data base, 2021. I. 27. |
Székely V, Poppe A, Páhi A, Csendes A, Hajas G, Rencz M: Electro-thermal and logi-thermal simulation of VLSI designs, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 5: (3) pp. 258-269. type of document: Journal paper/Article number of independent citations: 65 language: English URL |
1997
 from data base, 2021. I. 27. |
Szekely V, Marta C, Kohari Z, Rencz M: CMOS sensors for on-line thermal monitoring of VLSI circuits, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 5: (3) pp. 270-276. type of document: Journal paper/Article number of independent citations: 96 language: English URL |
| Number of independent citations to these publications: | 394  |
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