Print preview personal data approved: 2024. I. 24. Publications |
2021
from data base, 2023. I. 23. |
Illés Balázs, Hurtony Tamás, Medgyes Bálint, Krammer Olivér, Dusek Karel, Busek David: Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers, VACUUM 187: 110121 type of document: Journal paper/Article number of independent citations: 5 language: English URL |
2021
from data base, 2023. I. 23. |
Skwarek Agata, Krammer Olivér, Hurtony Tamás, Ptak Przemysław, Górecki Krzysztof, Wroński Sebastian, Straubinger Dániel, Witek Krzysztof, Illés Balázs: Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys, NANOMATERIALS 11: (6) 1545 type of document: Journal paper/Article number of independent citations: 8 language: English URL |
2020
from data base, 2023. I. 23. |
Veselý P., Bušek D., Krammer O., Dušek K.: Analysis of no-clean flux spatter during the soldering process, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 275: 116289 type of document: Journal paper/Article number of independent citations: 9 language: English URL |
2019
from data base, 2023. I. 23. |
Krammer Oliver, Dušek Karel: Numerical investigation on the effect of the printing force and squeegee geometry on stencil printing, JOURNAL OF MANUFACTURING PROCESSES 45: pp. 188-193. type of document: Journal paper/Article number of independent citations: 4 language: English URL |
2019
from data base, 2023. I. 23. |
Martinek Péter, Krammer Oliver: Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology, COMPUTERS AND INDUSTRIAL ENGINEERING 136: pp. 187-194. type of document: Journal paper/Article number of independent citations: 9 language: English URL |
2018
from data base, 2023. I. 23. |
O Krammer, B Gyarmati, A Szilágyi, B Illés, D Bušek, K Dušek: The effect of solder paste particle size on the thixotropic behaviour during stencil printing, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 262: pp. 571-576. type of document: Journal paper/Article number of independent citations: 12 language: English URL |
2018
from data base, 2023. I. 23. |
K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés: Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect), JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 251: pp. 20-25. type of document: Journal paper/Article number of independent citations: 8 language: English URL |
2015
from data base, 2023. I. 23. |
O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab: Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders, JOURNAL OF ALLOYS AND COMPOUNDS 634: pp. 156-162. type of document: Journal paper/Article number of independent citations: 13 language: English URL |
2014
from data base, 2023. I. 23. |
O Krammer: Comparing the Reliability and Intermetallic Layer of Solder Joints prepared with Infrared and Vapour Phase soldering, SOLDERING & SURFACE MOUNT TECHNOLOGY 26: (4) pp. 214-222. type of document: Journal paper/Article number of independent citations: 35 language: English URL |
2013
from data base, 2023. I. 23. |
Benedek Cs, Krammer O, Janóczki M, Jakab L: Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 60: (6) pp. 2318-2331. type of document: Journal paper/Article number of independent citations: 39 language: English URL |
| Number of independent citations to these publications: | 142 |
|
|