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| Data sheet of PhD student |
 Print preview| Publications |
2023
 from data base, 2023. VI. 01. |
Dániel Straubinger: NOVEL ASPECTS OF REFLOW SOLDERING IN ELECTRONICS MANUFACTURING,
type of document:
language: English
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2022
from data base, 2023. VI. 01. |
Straubinger Daniel, Toth Attila, Kerek Viktor, Czeczei Zsolt, Szabo Andras, Geczy Attila: Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors, SOLDERING & SURFACE MOUNT TECHNOLOGY 34: (4) pp. 203-211.
type of document: Journal paper/Article
language: English
URL |
2022
from data base, 2023. VI. 01. |
Straubinger Dániel, Illés Balázs, Busek David, Codreanu Norocel, Géczy Attila: Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment, CASE STUDIES IN THERMAL ENGINEERING 33: 102001
type of document:
number of independent citations: 3
language: English
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2022
from data base, 2023. VI. 01. |
Geczy Attila, Csiszar Andras, Rozs Egon, Hajdu Istvan, Medgyes Balint, Krammer Oliver, Straubinger Daniel, Gal Laszlo: Novel PLA/Flax Based Biodegradable Printed Circuit Boards, In: IEEE, , (szerk.) 2022 45th International Spring Seminar on Electronics Technology (ISSE), IEEE (2022) pp. 1-6.
type of document: Part of book/Proceedings Paper
number of independent citations: 2
language: English
URL |
2022
from data base, 2023. VI. 01. |
Straubinger Dániel, Hurtony Tamás, Géczy Attila: Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY 21: pp. 308-318.
type of document: Journal paper/Article
number of independent citations: 5
language: English
URL |
2021
from data base, 2023. VI. 01. |
Skwarek Agata, Krammer Olivér, Hurtony Tamás, Ptak Przemysław, Górecki Krzysztof, Wroński Sebastian, Straubinger Dániel, Witek Krzysztof, Illés Balázs: Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys, NANOMATERIALS 11: (6) 1545
type of document: Journal paper/Article
number of independent citations: 11
language: English
URL |
2021
from data base, 2023. VI. 01. |
Illes Balazs, Skwarek Agata, Krammer Oliver, Straubinger Daniel, Lako Bence, Harsanyi Gabor, Witek Krzysztof: Soldering with SACX0307-(TiO 2 /ZnO) nano-composite solder alloys, In: IEEE, , (szerk.) 2021 44th International Spring Seminar on Electronics Technology (ISSE), IEEE (2021) 9467652
type of document: Part of book/Proceedings Paper
number of independent citations: 1
language: English
URL |
2021
from data base, 2023. VI. 01. |
Straubinger Daniel, Geczy Attila: Effect of highly increased current density in the microstructure of lead-free solder joints, In: IEEE, , (szerk.) 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), IEEE (2021) pp. 1-5.
type of document: Part of book/Proceedings Paper
language: English
URL |
2021
from data base, 2023. VI. 01. |
Illes Balazs, Skwarek Agata, Krammer Oliver, Hurtony Tamas, Straubinger Daniel, Ratajczak Jacek, Harsanyi Gabor, Witek Krzysztof: Properties of nano-composite SACX0307-(ZnO, TiO 2 ) solders, In: IEEE, , (szerk.) 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), IEEE (2021) pp. 1-6.
type of document: Part of book/Proceedings Paper
number of independent citations: 1
language: English
URL |
2021
from data base, 2023. VI. 01. |
Géczy Attila, Alaya Mohamed Amine, Rozs Egon, Straubinger Daniel, Illes Balazs: Flow and Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control, In: IEEE, , (szerk.) 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), IEEE (2021) pp. 111-114.
type of document: Part of book/Proceedings Paper
language: English
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2021
from data base, 2023. VI. 01. |
Straubinger Daniel, Toth Attila: Extending Insight About Solder Beading Effect Under Surface-mounted Electrolytic Capacitors, In: IEEE, . (szerk.) 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME), IEEE (2021) pp. 205-209.
type of document: Part of book/Proceedings Paper
language: English
URL |
2020
from data base, 2023. VI. 01. |
Straubinger Daniel, Rigler Daniel, Geczy Attila, Synkiewicz-Musialska Beata: Electromigration in lead-free solder joints on ceramic PCB substrates, In: Gabriel, Chindris (szerk.) 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME 2020), IEEE (2020) pp. 52-56.
type of document: Part of book/Proceedings Paper
language: English
URL |
2020
from data base, 2023. VI. 01. |
Straubinger Daniel, Bozsóki István, Bušek David, Illés Balázs, Géczy Attila: Modelling of temperature distribution along PCB thickness in different substrates during reflow, CIRCUIT WORLD 46: (2) pp. 85-92.
type of document: Journal paper/Article
number of independent citations: 11
language: English
URL |
2020
from data base, 2023. VI. 01. |
Straubinger Daniel, Illes Balazs, Berenyi Richard, Geczy Attila: Simulation of reflow-based heat transfer on different thermocouple constructions, In: IEEE (szerk.) 2020 43rd International Spring Seminar on Electronics Technology (ISSE), IEEE (2020) 9120968
type of document: Part of book/Proceedings Paper
number of independent citations: 2
language: English
URL |
2020
from data base, 2023. VI. 01. |
Straubinger Daniel, Bozsóki István, Illes Balazs, Krammer Oliver, Bušek David, Geczy Attila: Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces, SOLDERING & SURFACE MOUNT TECHNOLOGY 32: (4) pp. 247-252.
type of document: Journal paper/Article
number of independent citations: 1
language: English
URL |
2019
from data base, 2023. VI. 01. |
Dániel Straubinger, Attila Géczy, András Sipos, András Kiss, Dániel Gyarmati, Oliver Krammer, Dániel Rigler, David Bušek, Gábor Harsányi: Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs, CIRCUIT WORLD 45: (1) pp. 37-44.
type of document: Journal paper/Article
number of independent citations: 10
language: English
URL |
2019
from data base, 2023. VI. 01. |
Géczy Attila, Mohamed Amine Alaya, Straubinger Dániel, Hantos Gusztáv, Bozsóki István: A gőzfázisú újraömlesztéses forrasztás megfigyelése újszerű alkalmazott szenzorikai módszerekkel, ELEKTRONIKAI TECHNOLÓGIA ÉS GYÁRTÁSINFORMATIKA 1: (2) pp. 15-18.
type of document: Journal paper/Review paper
language: Hungarian
URL |
2019
from data base, 2023. VI. 01. |
Alaya Mohamed Amine, Gal Laszlo, Hurtony Tamas, Medgyes Balint, Straubinger Daniel, Tareq I Al-Maaiteh, Illes Balazs, Geczy Attila: Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering, In: IEEE (szerk.) 2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), IEEE (2019) pp. 1-6.
type of document: Part of book/Proceedings Paper
number of independent citations: 1
language: English
URL |
2019
from data base, 2023. VI. 01. |
Straubinger Daniel, Bozsoki Istvan, Illes Balazs, Geczy Attila: Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering, In: IEEE (szerk.) 2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), IEEE (2019) pp. 1-5.
type of document: Part of book/Proceedings Paper
number of independent citations: 3
language: English
URL |
2019
from data base, 2023. VI. 01. |
Geczy Attila, Szalmasi Daniel, Straubinger Daniel, Illes Balazs: Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering, In: Gabriel, Chindris (szerk.) 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), IEEE (2019) pp. 343-346.
type of document: Part of book/Proceedings Paper
number of independent citations: 1
language: English
URL |
2019
from data base, 2023. VI. 01. |
Straubinger Daniel, Bozsoki Istvan, Gal Laszlo, Geczy Attila: Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering, In: Gabriel, Chindris (szerk.) 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), IEEE (2019) pp. 155-159.
type of document: Part of book/Proceedings Paper
language: English
URL |
2018
from data base, 2023. VI. 01. |
Attila Géczy, Dániel Straubinger, András Kovács, Oliver Krammer, Pavel Mach, Gábor Harsányi: Effects of high current density on lead-free solder joints of chip-size passive SMD components, SOLDERING & SURFACE MOUNT TECHNOLOGY 30: (2) pp. 74-80.
type of document: Journal paper/Article
number of independent citations: 6
language: English
URL |
2017
from data base, 2023. VI. 01. |
Attila Géczy, Dániel Straubinger, Tamás Hurtony, Olivér Krammer, András Kovács: Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach, In: J, Nikolic; H, Wohlrabe (szerk.) 2017 40th IEEE International Spring Seminar on Electronics Technology, IEEE (2017) 8000930
type of document: Part of book/Proceedings Paper
number of independent citations: 2
language: English
URL |
2017
from data base, 2021. I. 12. |
Geczy Attila, Straubinger Daniel, Hurtony Tamas, Krammer Oliver, Kovacs Andras: Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach, INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY ISSE 2017: 8000930
type of document: Journal paper/Konferenciaközlemény
language: English
URL |
| | Number of independent citations to these publications: | 60 |
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