Print previewpersonal data approved: 2023. IV. 25. Publications |
2022
 from data base, 2023. IV. 25. |
Bognár György, Takács Gábor, Szabó Péter Gábor: Thermal Modeling of Embedded Microscale Channel Structures Realized in Heterogeneous Packaging, In: Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22), IEEE (2022) 144 type of document: Part of book/Proceedings Paper language: English
|
2020
 from data base, 2023. IV. 25. |
Abdulrazzaq Ali Kareem, Bognár György, Plesz Balázs: Evaluation of different methods for solar cells/modules parameters extraction, SOLAR ENERGY 196: pp. 183-195. type of document: Journal paper/Article number of independent citations: 29 language: English URL |
2020
 from data base, 2023. IV. 25. |
Bognár György, Takács Gábor, Szabó Péter G., Rózsás Gábor, Pohl László, Plesz Balázs: Integrated Thermal Management in System-on-Package Devices, PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE 64: (2) pp. 200-210. type of document: Journal paper/Article language: English URL |
2018
 from data base, 2023. IV. 25. |
Gy. Bognár, G. Takács, L. Pohl, P. G. Szabó: Thermal modelling of integrated microscale heatsink structures, MICROSYSTEM TECHNOLOGIES 24: (1) pp. 433-444. type of document: Journal paper/Article number of independent citations: 5 language: English URL |
2018
 from data base, 2023. IV. 25. |
G. Rózsás, Gy. Bognár, G. Takács, B. Plesz: Fabrication of a backside contact integrated microchannel cooling for concentrator solar cells, In: IET, ,; Czech, Technical University (szerk.) Proceedings of the 9th International Workshop on Teaching in Photovoltaics (IWTPV'18), Czech Technical University in Prague (2018) pp. 15-19. type of document: Part of book/Proceedings Paper language: English
|
2017
 from data base, 2023. IV. 25. |
György Bognár, Gábor Takács, László Pohl, Lázár Jani, András Timár, Péter Horváth, Márton Németh, András Poppe, Péter Gábor Szabó: Integrating Chip-level Microfluidics Cooling into System Level Design of Digital Circuits, In: Veerendra, Mulay; Jesse, Galloway; Adriana, Rangel (szerk.) Proceedings of the 33rd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'17), IEEE (2017) pp. 77-87. type of document: Part of book/Proceedings Paper language: English URL |
2017
 from data base, 2023. IV. 25. |
Gábor Takács, György Bognár, Enikő Bándy, Gábor Rózsás, Péter G. Szabó: Fabrication and Characterization of Microscale Heat Sinks, MICROELECTRONICS RELIABILITY 79: pp. 480-487. type of document: Journal paper/Article number of independent citations: 6 language: English URL |
2016
 from data base, 2023. IV. 25. |
G. Takács, P. G. Szabó, Gy. Bognár: Enhanced thermal characterization method of microscale heatsink structures, MICROELECTRONICS RELIABILITY 67: pp. 21-28. type of document: Journal paper/Article number of independent citations: 7 language: English URL |
2005
 from data base, 2023. IV. 25. |
G Farkas, Q van Voorst Vader, A Poppe, Gy Bognár: Thermal Investigation of High Power Optical Devices by Transient Testing, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 28: (1) pp. 45-50. type of document: Journal paper/Article number of independent citations: 94 language: English URL |
2004
 from data base, 2017. III. 16. |
G Farkas, S Haque, F Wall, P S Martin, A Poppe, Q van Voorst Vader, Gy Bognár: Electric and Thermal Transient Effects in High Power Optical Devices, In: Szerk.: IEEE Proceedings of the 20th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'04). New York: IEEE Press, 2004. pp. 168-176. type of document: Part of book/Proceedings Paper number of independent citations: 41 language: English DOI |
| Number of independent citations to these publications: | 182  |
|
|