personal data approved: 2022. XI. 30. Publications |
2020
from data base, 2021. I. 07. |
Pázmán Judit, Fehér Jánosné, Gonda Viktor, Sánta Edit Orsolya, Verő Balázs: Az Al5182 ötvözet teljesítőképességének meghatározása, BÁNYÁSZATI ÉS KOHÁSZATI LAPOK-KOHÁSZAT 153: (4) pp. 41-47. type of document: Journal paper/Article language: Hungarian Full text |
2019
from data base, 2021. I. 07. |
C Ramiro S. Vargas, Gonda Viktor: Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder, In: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), (2019) pp. 1-6. type of document: Part of book/Proceedings Paper language: English URL |
2019
from data base, 2021. I. 07. |
Ramiro Vargas, Viktor Gonda: Comparison of creep behavior for lead free solders Sn-3.5Ag, SAC305 and SAC387, BÁNKI KÖZLEMÉNYEK (2) pp. 2-16. type of document: Journal paper/Article language: English
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2019
from data base, 2021. I. 07. |
Fejes Gergő Richárd, Gonda Viktor: Könyöksajtolt réz átalakulási kinetikájának vizsgálata, BÁNKI KÖZLEMÉNYEK (1) pp. 16-22. type of document: Journal paper/Article language: Hungarian
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2019
from data base, 2021. I. 07. |
Csukás Martin, Horváth Richárd, Gonda Viktor, Oláh Ferenc: Azonos térfogatú metaanyag próbatestek terhelhetőségének vizsgálata, In: Horváth, Richárd; Beke, Éva; Stadler, Róbert Gábor (szerk.) Mérnöki Szimpózium a Bánkin előadásai : Proceedings of the Engineering Symposium at Bánki (ESB 2019), Óbudai Egyetem (2019) pp. 43-48. type of document: Part of book/Proceedings Paper language: Hungarian
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2018
from data base, 2021. I. 07. |
Ramiro Vargas, Viktor Gonda, Lourdes Ruiz: Thermal analysis and control for heating of an extrusion die, BÁNKI KÖZLEMÉNYEK 1: (1) pp. 63-66. type of document: Journal paper/Article language: English
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2018
from data base, 2021. I. 07. |
Kawan Mahmood Abdulrahman, Viktor Gonda, Mihály Réger: Comparison of the techniques to produce non-dendritic feedstocks for thixoforming, BÁNKI KÖZLEMÉNYEK 1: (2) pp. 57-61. type of document: Journal paper/Article language: English
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2018
from data base, 2021. I. 07. |
Viktor Gonda: Thermal behavior of copper processed by ECAP at elevated temperatures, American Institute of Physics type of document: language: English
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2018
from data base, 2021. I. 07. |
Viktor Gonda: Thermal behavior of copper processed by ECAP at elevated temperatures, AIP CONFERENCE PROCEEDINGS 1960: (1) 080002 type of document: Journal paper/Konferenciaközlemény number of independent citations: 1 language: English URL |
2018
from data base, 2021. I. 07. |
Gábor Ladányi, Viktor Gonda: Peridynamic Modelling of Crack Initiation and Propagation in Thermo-mechanically Loaded Electronic Devices, In: IEEE (szerk.) Proceedings of the 19th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'18), IEEE (2018) pp. 1-5. type of document: Part of book/Proceedings Paper language: English URL |
| Number of independent citations to these publications: | 1 |
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